3D X-Ray Inspection (AXI)

TRI’s 3D X-Ray Inspection systems — including the high-speed inline TR7600 SIII and high-resolution CT TR7600F3D SII — use X-ray imaging to see inside solder joints and underneath components, inspecting what cameras simply cannot reach.

Using computed tomography (CT) or laminography, they build 3D cross-sectional views of the board to inspect:

• Hidden solder joints — BGA, QFN, LGA, and other bottom-terminated components where connections sit beneath the package
• Voiding — air pockets trapped inside solder joints that weaken thermal or electrical performance
• Head-in-pillow defects — partial BGA connections that look fine from the outside
• Bridging & shorts — solder bridges buried under components or between layers
• Internal structural defects — cracks, cold joints, insufficient wetting hidden from optical systems

Why they matter:

As components shrink and BGAs dominate modern PCB designs, more and more critical solder joints are completely invisible to AOI. TRI’s 3D X-ray is the only way to verify them non-destructively. The inline TR7600 SIII delivers full-speed inspection without creating a bottleneck, while the CT-grade TR7600F3D SII provides the resolution needed for advanced packaging and high-reliability applications. It is the last line of defence before product ships — catching the defects that nothing else can see.