Automated Optical Inspection (AOI)

TRI’s 3D AOI range — from the high-speed TR7700Q SII to the multi-angle TR7500QE Plus — uses 21-megapixel cameras, 9.8µm resolution, and AI-driven defect detection to automatically scan assembled PCBs after component placement and reflow soldering.

They inspect for:

• Missing or misaligned components — parts that shifted, tombstoned, or were never placed
• Solder joint quality — insufficient solder, excess solder, bridging, cold joints
• Polarity & orientation — components placed the wrong way round
• Wrong parts — incorrect component values or types
• Foreign material & damage — contamination, cracks, or lifted leads

Why they matter:

TRI’s AOI is the workhorse of SMT quality control. It catches defects at line speed without contact, keeping throughput high while preventing faulty boards from reaching later, more expensive test stages — or the customer. TRI’s 3D AOI adds true height measurement and metrology-grade accuracy, making it far more reliable at catching defects like head-in-pillow and insufficient solder that 2D systems miss. The multi-angle TR7500QE Plus goes further still, inspecting hidden solder joints that top-down systems cannot see.