Solder Paste Inspection (SPI)

TRI’s 3D SPI systems — led by the TR7007Q SII — are automated optical systems that inspect the quality of every solder paste deposit on a PCB immediately after the stencil printing stage, before any components are placed.

Using shadow-free 3D measurement technology, they inspect:

• Volume — is there enough (or too much) paste on each pad?
• Height — is the deposit the right thickness?
• Area & alignment — does the paste sit accurately on the pad?
• Bridging — is paste smearing between adjacent pads?

Why they matter:

Up to 70% of SMT defects trace back to poor solder paste printing. TRI’s SPI catches those issues before components are placed and reflowed — when rework is cheap and easy. With AI-powered algorithms that minimise false calls and rapid 5-step programming for fast setup, the TR7007Q SII keeps your print process locked in and your line running.